Samsung Electronics’ System LSI Division and Sony will compete in the 16 million pixel complementary metal-oxide semiconductor (CMOS) image sensor market for smartphones.
Over the years, Sony had an absolute power in the high-pixel (13 million or more) CMOS image sensor (CIS) market. However, in the second half of this year, Samsung Electronics’ System LSI Division broke the market structure of monopoly by Sony and has since been catching up with Sony at a high speed.
According to the industry on the 20th, Samsung Electronics’ Wireless Business Division decided to adopt a 16 million pixel camera model for Galaxy S5 to be released in the first half of next year. Samsung is scheduled to start a sample test for the 16 million pixel camera module as early as the beginning of next month and to select key parts suppliers before the yearend.
While it is forecast that Samsung will keep its existing suppliers for camera module, lens and auto-focusing (AF) actuator, System LSI Division and Sony are fiercely competing over a spot as a CIS main supplier.
Samsung Electronics’ flagship models, such as Galaxy Note 3 and Galaxy S4 released this year, are mostly mounted with Sony’s CIS as a strategic product. Sony holds the most advanced technological power in the field of CIS with 13 million pixels or higher. Sony’s CIS is mostly produced in the 300mm wafer line, and thus the company benefits from high effects of the economy of scale.
It is reported that Sony is currently promoting to conclude an exclusive distributorship contract for 16 million pixel CIS for a set period of time with Samsung Electronics’ Wireless Business Division. Sony, in fact, is focusing solely on Samsung Electronics’ smartphones for its CIS business.
System LSI Division’s counterattack is quite formidable, however. System LSI Division broke the market structure of Sony’s monopoly by localizing 13 million pixel CIS in June. It has also secured a new weapon, ISOCELL.
ISOCELL is a technology to convert a sensor structure so as to make the most use of light gathered in the pixels. In the past, the best way to have a small-sized CIS absorb a large amount of light was to increase the sensitivity and minimize the compounding of colors. This is where Sony had its competitive edge.
System LSI Division overcame the spatial limit by converting CIS pixel structure from a plane to a 3D structure. With ISOCELL technology, it succeeded in mass-producing 8 million pixel CIS and released 13 million and 16 million pixel samples.
System LSI Division plans to increase 300mm CIS wafer input from 4,000 sheets a month to 8,000 in its Giheung Plant. With the increased percentage of 300mm wafer production, a greater cost reduction effect is also anticipated.
“We have no reason not to work with Sony or System LSI Division as long as they can prove their 16 million pixel CIS performance and mass-production capacities,” explained an insider from Samsung Electronics’ Wireless Business Division. “Things will take shape around the yearend because even a camera module sample test has not been completed yet.”
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